MULTILAYER PCB MANUFACTURING
What is Multilayer PCB?
Multilayer PCB refers to the circuit card that is laminated by 3 or more copper layers. With the exception of the 2 outdoor copper layers, more copper layers are sandwiched in between the protecting products. Although the manufacturing capacities of a couple of distributors are claimed beyond 40+ layers (We can rise to 40 layers), 99% of the present market need is concentrated in 4-16 layers multilayer boards.
Benefits of Multilayer PCBs ?
Contrasted to 1 or 2 sided circuit boards, multilayer boards sustain denser style as well as design, saving more spacing, which remain in line with the trend of smaller sized and also smaller interaction products. Multilayer boards decrease the demand for cords, successfully shorten the range in between signal lines, sensible internal layer style can significantly minimize EMI, which fulfill the high-frequency communications.
Leading Multilayer PCB Manufacturer?
MULTILAYER PCB CAPABILITIES
Items | Parameters |
|---|---|
Material | FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc |
Material Brands | KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or other laminate on customer's request |
Layer Count | 1-40 |
Flammaility | UL 94V-0 |
Thermal Conductivity | 0.3W-300W/mk |
Quality Standards | IPC Classes 2/3 |
HDI Build-up | Any Layer, up to 3+N+3 |
Max Length | 1500mm |
Board Thickness | 0.2~7mm |
Min Thickness | 2-layer: 0.2mm 4-layer: 0.4mm 6-layer: 0.6mm 8-layer: 0.8mm 10-layer: 1mm More than 10 layers: 0.5*Layer Count*0.2mm |
Copper Thickness | 0.5-12oz |
Solder Mask Colors | White, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black; Carbon Ink |
Inks | Super White Inks/Solar/Carbon Inks |
Solder Mask Thickness | 0.2mil-1.6mil |
Solder Mask Dam | 4mil |
Surface Finishes | Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc |
Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
Min Hole Size | 0.15mm |
Min Trace Width/Spacing | 2mil/2mil |
Minimum Solder Mask Clearance | 2mil |
Min Annular Ring | 4mil |
Min Pad to Pad Clearance | 2mil |
Via Plugging | 0.2~0.8mm |
Line Width/Space Tolerance | ±10% |
Board Thickness Tolerance | ±5% |
Hole Diameter Tolerance | ±0.05mm |
Hole Location Tolerance | ±2mil |
Layer to Layer Registration | 2mil |
S/M Registration | 1mil |
Aspect Ratio | 10:01 |
Blind Vias Aspect Ratio | 1:01 |
Outline Tolerance | ±0.1mm |
V- CUT Tolerance | ±10mi |
Bevel Edge | ± 5mil |
Warp and Twist | ≤0.50% (max cap) |
Quality Test | AOI, 100% E-test |
Value-Added Services | DFM Check,Expedited Production |
Featured Processes | Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat |
Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
PRODUCTS SHOWCASE
6L HDI PCB
12L HDI PCB
HDI PCB PANEL
MICROo-VIA FR4 PCB
FEATURED PROCESS
Tenting Vias
It means that the vias are simply covered by solder mask ink. No additional process steps are required during fabrication.
Plugged Vias
For better BGA soldering, plugin the vias with inks or resin to prevent solder paste flow down into the vias.
Edge-plating
Metalization of the board edge, for improving EMC performance, cooling, housing connection, Board-on-Board connection, or others.
Castellated Vias
Castellated vias are holes that are made off the edge of the boards plated with copper, mainly used for board-on-board connections.
Slots
Remove the area of a PCB specified by the design file to form a specific shape, it can be plated or non-plated, through slot or in-depth slot.
