What is HDI PCB?

HDI (High-density interconnected) multilayer PCB describes the one with a reasonably high trace distribution density making use of micro-blind/buried via technology. HDI PCB modern technology makes it possible for the end-product to be a lot more portable while satisfying higher standards of electronic performance and performance.

We have obtained almost 15 years of experience in HDI multilayer PCB manufacturing, which utilizes enhancing handling along with sophisticated equipment to make multi-layer HDI circuit cards.

Any-layer interconnects, 2mil trace/spacing, 3+N+3 buildup are all offered choices. Our HDI PCBs are currently widely utilized in interaction backplanes, 5g devices, smartphones, digital cameras, laptops, automobile electronics, etc.

HDI PCB Advantages

☆ More dense trace routing

☆ More stable power

☆ Reduce EMC interference

☆ Improve signal integrity

☆ Accelerate multilayer PCB development

☆ Good for SMDs placement

☆ More component space

HDI PCB Capabilities

Layer Buildup
HDI BuildupMicro ViasMass ProductionSmall-Middle BatchPrototypeAvailable
1+N+1Blind viasYesYesYes4 layers+
2+N+2Blind/Buried/Staggered viasYesYesYes6 layers+
2+N+2Blind/Buried/Staggered viasYesYesYes6 layers+
3+N+3Blind/Buried/Staggered viasYesYesYes8 layers+
3+N+3Blind/Buried/Staggered viasYesYesYes8 layers+


ItemsCapabilities
Quality GradeStandard IPC 2,3
Number of Layers4-40
Order Quantity1pc - 10000+pcs
Layer Buildup3+N+3, Anylayer interconnect
Build Time4 Days - 5 Weeks
MaterialFR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc
Board SizeMax: 508x580mm
Board Thickness0.2mm-3.0mm
Copper Weight (Finished)0.5oz-4oz
Min Tracing/Spacing2mil/2mil
Solder Mask ColorWhite, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black
Silkscreen ColorWhite, Black, Yellow
Surface FinishBare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc
Min Annular Ring4mil
Min Drilling Hole Diameter0.15mm
Other TechniquesVia in pad, back drills, buried capacitor, flex-rigid combination

HDI SPECIAL PROCESS

Back Drills
Back Drills
Back drilling is the procedure of creating vias
by eliminating the stub in multilayered printed
wiring boards, to permit signals to flow from one
layer of the board to one more, which is special
workmanship of control deepness boring.
Impedance Control
Impedance Control

Control the impedance value of the conductor
on the high-speed PCB within a certain range to
meet the data transfer requirements.

Via in pad
Via in pad
Via in pad is a process that is widely used
to accommodatehigh-density interconnect
technology.Via in pad belongs to the plated
holes and can be simply understood as a via
a hole in a BGA pad.

PRODUCTS SHOWCASE

Blind Vias PCB

6 Layers, ENIG
Blind Vias PCB.JPG

Rigid-Flex HDI PCB

12 Layers, 2+N+2 Buildup
12 Layer Rigid-Flex HDI PCB.jpg

Buried Vias PCB

8 Layers, Anylayer Interconnected
Buried Vias PCB.jpg

HDI PCB

4 Layers, IT180A Substrate
HDI PCB.jpg
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