What is HDI PCB?
HDI (High-density interconnected) multilayer PCB describes the one with a reasonably high trace distribution density making use of micro-blind/buried via technology. HDI PCB modern technology makes it possible for the end-product to be a lot more portable while satisfying higher standards of electronic performance and performance.
We have obtained almost 15 years of experience in HDI multilayer PCB manufacturing, which utilizes enhancing handling along with sophisticated equipment to make multi-layer HDI circuit cards.
Any-layer interconnects, 2mil trace/spacing, 3+N+3 buildup are all offered choices. Our HDI PCBs are currently widely utilized in interaction backplanes, 5g devices, smartphones, digital cameras, laptops, automobile electronics, etc.
HDI PCB Advantages
☆ More dense trace routing
☆ More stable power
☆ Reduce EMC interference
☆ Improve signal integrity
☆ Accelerate multilayer PCB development
☆ Good for SMDs placement
☆ More component space
HDI PCB Capabilities
| Layer Buildup | |||||
|---|---|---|---|---|---|
| HDI Buildup | Micro Vias | Mass Production | Small-Middle Batch | Prototype | Available |
| 1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
| 2+N+2 | Blind/Buried/Staggered vias | Yes | Yes | Yes | 6 layers+ |
| 2+N+2 | Blind/Buried/Staggered vias | Yes | Yes | Yes | 6 layers+ |
| 3+N+3 | Blind/Buried/Staggered vias | Yes | Yes | Yes | 8 layers+ |
| 3+N+3 | Blind/Buried/Staggered vias | Yes | Yes | Yes | 8 layers+ |
| Items | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2,3 |
| Number of Layers | 4-40 |
| Order Quantity | 1pc - 10000+pcs |
| Layer Buildup | 3+N+3, Anylayer interconnect |
| Build Time | 4 Days - 5 Weeks |
| Material | FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc |
| Board Size | Max: 508x580mm |
| Board Thickness | 0.2mm-3.0mm |
| Copper Weight (Finished) | 0.5oz-12oz |
| Min Tracing/Spacing | 2mil/2mil |
| Solder Mask Color | White, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 0.15mm |
| Other Techniques | Via in pad, back drills, buried capacitor, flex-rigid combination |
HDI SPECIAL PROCESS
Back drilling is the procedure of creating vias
by eliminating the stub in multilayered printed
wiring boards, to permit signals to flow from one
layer of the board to one more, which is special
workmanship of control deepness boring.
Control the impedance value of the conductor
on the high-speed PCB within a certain range to
meet the data transfer requirements.
Via in pad is a process that is widely used
to accommodatehigh-density interconnect
technology.Via in pad belongs to the plated
holes and can be simply understood as a via
a hole in a BGA pad.
PRODUCTS SHOWCASE
Blind Vias PCB
Rigid-Flex HDI PCB
Buried Vias PCB
HDI PCB
