What is LED Circuit Board?
LED circuit boards typically mean some LEDs were soldered on PCBs to developed lighting digital products, the LED PCB demands grow with the fast advancement of the printed circuit PCB sector.
As all of us understand that LED will certainly generate more heat compared with other devices, which needed the PCB to have a far better capability for dissipating warmth. For these special needs, metal PCBs are frequently utilized as circuit boards, such as aluminum PCBs, copper core PCBs.
This is since metal core PCBs can dissipate heat with much better effectiveness than a conventional FR4 PCB.
Our Product Advantages
☆ Capable of 1-300W LED Circuit Boards
☆ Length Up to 1500mm
☆ Bergquist and Ventec Materials
☆ 90% Reflectivity Super White Resist
☆ Hi-Pot (Withstand Voltage) Up to 5KV
LED Circuit Board Capabilities
Items | Parameters |
Material | Aluminum Base, Copper Base, FR4 (140Tg, 170Tg, 180Tg), CEM-1, CEM-3, Ceramic, FR4+Aluminum |
Material Brands | KB, ITEQ, SY, ISOLA, Arlon, Ventec, Laird, Bergquist, DENKA, Panasonic, or other laminate on customer's request |
1-40 | 1~6 |
Thermal Conductivity | 1W-300W/mk |
Flammaility | UL 94V-0, FV-0 |
Quality Standards | IPC Classes 2/3 |
Thickness | 0.2~7mm |
Copper Thickness | 0.5-10oz |
Solder Mask | White, Black, Green, Super White/Solar/Carbon Ink |
Solder Mask Thickness | 10-12μm |
Solder Mask Dam | 4mil |
Surface Finishes | Bare Copper, Hasl lead-free, ENIG, Gold Fingers, OSP, IAg, ISn, etc |
Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
Max Length | 1500mm |
Min Hole Size | 0.2mm |
Min Trace Width/Spacing | 3mil/3mil |
Minimum Solder Mask Clearance | 2mil |
Min Annular Ring | 4mil |
Min Pad to Pad Clearance | 2mil |
Via Plugging | 0.2~0.8mm |
Line Width/Space Tolerance | ±10% |
Board Thickness Tolerance | ±5% |
Hole Diameter Tolerance | ±0.05mm |
Hole Location Tolerance | ±2mil |
Layer to Layer Registration | 2mil |
S/M Registration | 1mil |
Aspect Ratio | 10:01 |
Outline Tolerance | ±0.1mm |
Bow & Twist | ≤0.50% (max cap) |
Quality Test | AOI, 100% E-test |
Value-Added Services | DFM Check, Expedited Production |
Featured Processes | COB Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat |
Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |