What is Flexible Circuit Board?
Flexible circuit board is also called FPC, it is a bendable circuit board. Flexible circuit boards meet the increasingly thin requirements of electronic parts, especially display parts, for the circuit boards, while being able to adapt to the multi-dimensional use environment, and has now become a key promoter of modern high-density electronic products. Flex copper clad laminates are generally composed of insulating substrates, which are general Polyimide, adhesive, and copper foil.
Flexible circuit boards require more elaborate processing and higher cost, PCBANow has been manufacturing FPCs for years, now can customize 1-12 layers FPC boards. We utilize equipment and processes that are more suitable for flex PCBs, not only to improve efficiency but also to minimize customer costs.
Flexible Circuit Board Advantages
☆Saving area, flexible circuit board style requires only around 10 percent of the area as well as weight of an ordinary circuit board assembly
☆High reliability, a flexible circuit board calls for fewer interconnects, does not have as many prospective sources for failure, which enhances their dependability.
☆Improved capabilities, a flexible circuits board work with essentially any sort of port or element as well as works well with options such as ZIP ports. They also carry out extremely well in extreme temperature levels.
☆Cost-effective, which consist of decreased product and also product packaging demands, lower parts replacement prices, and assembly errors that might result in the need for fixings.
These advantages make flexible circuit boards preferably fit for a vast array of applications in industries such as Armed force, Transportation, Medical, Consumer Electronic Devices, Automotive, Aerospace, Communications, and Industrial.
Flexible Circuit Board Capabilities
Item | Capabilities |
---|---|
Material | PI, PET, PEN, FR-4, Dupont |
Layer Count | Standard Flex Circuits: 1-12 Standard Rigid-flex Circuits: 1-18 |
Flammaility | UL 94V-0 |
Quality Standards | IPC Classes 2/3 |
Max Board Dimension | 508×580mm |
Finish Thickness | Flex Board: 0.15–0.63mm Rigid-flex Board: 0.06-4.0mm |
Copper Thickness | 1/3-2oz |
Stiffener Material | Polyimide/FR4/Metal |
Cover Film | Black, Yellow |
Solder Mask Dam | 4mil |
Surface Finishes | ENIG, Gold Fingers, ENEPIG, Electrolytic Wire Bondable Gold, OSP, IAg, ISn, etc |
Plating Thickness | Immersion Nickel/Gold: Nickel: 100u"-200u" Gold: 1u"-5u" Gold Plating: Nickel: 100u"-200u" Gold: 1u"-4u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
Min Hole Size | 3mil |
Min Trace Width/Spacing | 2mil/2mil |
Minimum Solder Mask Clearance | 3mil |
Min Annular Ring | 4mil |
Board Thickness Tolerance | ±5% |
Hole Diameter Tolerance | ±2mil |
Hole Location Tolerance | ±4mil |
Outline Tolerance | ±3mil |
Aspect Ratio | 0.25 |
Quality Test | AOI, 100% E-test |
Value-Added Services | DFM Check, Expedited Production |
Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |