Circuit Board Materials Types
Although Our high-quality materials are directly sourced from Shengyi, KB, ITEQ, Rogers, Dupont, Rohmhass, Taconic, and other excellent suppliers, we still set up strict IQC inspection and ask for replacement once any pieces of the material cannot meet our inspection indicates.
The materials for making electronic circuit boards are called copper-clad laminates (CCL), which can be divided into different types according to different parameters or usage. Our clients can customize the materials as to the requirements of the products, the listed below are the main ones we use, for your better understanding before ordering.
GENERAL PROPERTIES
| Materials | Items | Parameters |
|---|---|---|
 FR4 | Flammability Flexural Strength Dielectric Constant @ 1MHz Coefficient of Thermal Expansion Loss Tangent @ 1MHz Thermal Conductivity | UL-94V0 500~600Mpa Lengthwise / 400~500Mpa Crosswise ~4.7 ~55ppm/℃ before Tg / ~285ppm/℃ after Tg 0.017 Up to 0.8w/mk |
 CEM-3 | Flammability Flexural Strength Dielectric Constant @ 1MHz Tg Coefficient of Thermal Expansion Loss Tangent @ 1MHz Thermal Conductivity | UL-94V0 300~400Mpa Lengthwise / 200~300Mpa Crosswise 4.5~4.8 ~130℃ ~55ppm/℃ before Tg / ~285ppm/℃ after Tg 0.02 Up to 0.8w/mk |
 Polyimide | Flammability Tensile Strength Dielectric Constant @ 1MHz Tg Coefficient of Thermal Expansion Loss Tangent @ 1MHz Thermal Conductivity | UL-94V0 ~72Mpa 4.2 >250℃ ~55ppm/℃ before Tg / ~149ppm/℃ after Tg 0.018 ~0.2w/mk |
 Aluminum Clad | Flammability Tensile Strength Dielectric Breakdown Tg Coefficient of Thermal Expansion Td Thermal Conductivity | UL-94V0 ~450Mpa Lengthwise / ~390Mpa Crosswise 6.0KV 100~170℃ ~27ppm/℃ before Tg / ~30ppm/℃ after Tg ~400℃ 1.0~3.0w/mk |
 RO4350 | Flammability Tensile Strength Dielectric Constant @ 10GHz Tg Coefficient of Thermal Expansion Loss Tangent @ 10GHz Thermal Conductivity | UL-94V0 ~255Mpa 3.5 >280℃ ~32ppm/℃ 0.0037 0.69w/mk |
 Taconic TLC | Flammability Tensile Strength Dielectric Constant @ 10GHz Tg Coefficient of Thermal Expansion Loss Tangent @ 10GHz Thermal Conductivity | UL-94V0 >276Mpa Lengthwise / >241Mpa Crosswise ~3.2 >280℃ 70ppm/℃ 0.003 0.24w/mk |
| Defect Level | No. | Item | Inspection Method | Tools |
|---|---|---|---|---|
| Serious Issues | 1 | Color Watermark | Visually | Sample |
| 2 | Sheet Thickness | Four corners measuring | Micrometer/Caliper | |
| 3 | Copper Foil Thickness | Measure five points on each side | Copper thickness gauge | |
| 4 | Etchability | Cutting board etching | Etching machine | |
| 5 | Combustion Test | Ignition test | Lighter. Alcohol lamp | |
| 6 | Thermal Stress | Fr-4 288±5℃*10±2s*3 times. | Tin furnace. Thermometer | |
| 7 | Thermal Stress | Cem-3 288±5℃*10±2s*2 times | Tin furnace. Thermometer | |
| 8 | Thermal Stress | Cem-1 260±5℃*10±2s*3 times. | Tin furnace. Thermometer | |
| 9 | Solder Heat Resistant | Fr-1 260±5℃*10±2s*1 times | Tin furnace. Thermometer | |
| 10 | Peel Strength | Visually | Peel strength machine | |
| 11 | Validity Of Icp Report | Per batch | Visual. Check | |
| 12 | Chemical Testing | 1 time/batch | EDX test | |
| 13 | Tg Value | 1 piece/batch | Tg test | |
| Main Issues | 1 | Length And Width | Measurement | Tape measure |
| 2 | Watermark Logo | Visually | Sample | |
| 3 | Broken Corner. Rotten Board | Visually | Tape measure | |
| 4 | Indentation. Dent | Visually | Tape measure | |
| 5 | Pockmarks. Pinholes | Visually | Tape measure | |
| 6 | Wrinkled. Rough | Visually | Tape measure | |
| 7 | Scratches | Visually | Tape measure | |
| Secondary Issues | 1 | Pollution. Oxidation | Visually | |
| 2 | Burr. Phifeng | Sight. Feel |
MATERIAL INSPECTION EQUIPMENT
At IQC, we carry out strict random inspection + full inspection to confirm the ICP test report, MSDS data, and environmental compliance
and manage the unqualified materials by returning, replacing, and scrapping. The testing tools used, such as calipers, copper foil testers, etc.,
must be self-tested and confirmed in accordance with the instrument self-test operation guidelines before daily use.
