Circuit Board Materials Types

Although Our high-quality materials are directly sourced from Shengyi, KB, ITEQ, Rogers, Dupont, Rohmhass, Taconic, and other excellent suppliers, we still set up strict IQC inspection and ask for replacement once any pieces of the material cannot meet our inspection indicates.

The materials for making electronic circuit boards are called copper-clad laminates (CCL), which can be divided into different types according to different parameters or usage. Our clients can customize the materials as to the requirements of the products, the listed below are the main ones we use, for your better understanding before ordering.

GENERAL PROPERTIES

MaterialsItemsParameters

FR4

Flammability

Flexural Strength

Dielectric Constant @ 1MHz

Coefficient of Thermal Expansion

Loss Tangent @ 1MHz

Thermal Conductivity

UL-94V0

500~600Mpa Lengthwise / 400~500Mpa Crosswise

~4.7

~55ppm/℃ before Tg / ~285ppm/℃ after Tg

0.017

Up to 0.8w/mk

CEM-3

Flammability

Flexural Strength

Dielectric Constant @ 1MHz

Tg

Coefficient of Thermal Expansion

Loss Tangent @ 1MHz

Thermal Conductivity

UL-94V0

300~400Mpa Lengthwise / 200~300Mpa Crosswise

4.5~4.8

~130℃

~55ppm/℃ before Tg / ~285ppm/℃ after Tg

0.02

Up to 0.8w/mk

Polyimide

Flammability

Tensile Strength

Dielectric Constant @ 1MHz

Tg

Coefficient of Thermal Expansion

Loss Tangent @ 1MHz

Thermal Conductivity

UL-94V0

~72Mpa

4.2

>250℃

~55ppm/℃ before Tg / ~149ppm/℃ after Tg

0.018

~0.2w/mk

Aluminum Clad

Flammability

Tensile Strength

Dielectric Breakdown

Tg

Coefficient of Thermal Expansion

Td

Thermal Conductivity

UL-94V0

~450Mpa Lengthwise / ~390Mpa Crosswise

6.0KV

100~170℃

~27ppm/℃ before Tg / ~30ppm/℃ after Tg

~400℃

1.0~3.0w/mk

RO4350

Flammability

Tensile Strength

Dielectric Constant @ 10GHz

Tg

Coefficient of Thermal Expansion

Loss Tangent @ 10GHz

Thermal Conductivity

UL-94V0

~255Mpa

3.5

>280℃

~32ppm/℃

0.0037

0.69w/mk

Taconic TLC

Flammability

Tensile Strength

Dielectric Constant @ 10GHz

Tg

Coefficient of Thermal Expansion

Loss Tangent @ 10GHz

Thermal Conductivity

UL-94V0

>276Mpa Lengthwise / >241Mpa Crosswise

~3.2

>280℃

70ppm/℃

0.003

0.24w/mk

Defect LevelNo.ItemInspection MethodTools
Serious Issues1Color WatermarkVisuallySample
2Sheet ThicknessFour corners measuringMicrometer/Caliper
3Copper Foil ThicknessMeasure five points on each sideCopper thickness gauge
4EtchabilityCutting board etchingEtching machine
5Combustion TestIgnition testLighter. Alcohol lamp
6Thermal StressFr-4 288±5℃*10±2s*3 times.Tin furnace. Thermometer
7Thermal StressCem-3 288±5℃*10±2s*2 timesTin furnace. Thermometer
8Thermal StressCem-1 260±5℃*10±2s*3 times.Tin furnace. Thermometer
9Solder Heat ResistantFr-1 260±5℃*10±2s*1 timesTin furnace. Thermometer
10Peel StrengthVisuallyPeel strength machine
11Validity Of Icp ReportPer batchVisual. Check
12Chemical Testing1 time/batchEDX test
13Tg Value1 piece/batchTg test
Main Issues1Length And WidthMeasurementTape measure
2Watermark LogoVisuallySample
3Broken Corner. Rotten BoardVisuallyTape measure
4Indentation. DentVisuallyTape measure
5Pockmarks. PinholesVisuallyTape measure
6Wrinkled. RoughVisuallyTape measure
7ScratchesVisuallyTape measure
Secondary Issues1Pollution. OxidationVisually
2Burr. PhifengSight. Feel

MATERIAL INSPECTION EQUIPMENT

At IQC, we carry out strict random inspection + full inspection to confirm the ICP test report, MSDS data, and environmental compliance

and manage the unqualified materials by returning, replacing, and scrapping. The testing tools used, such as calipers, copper foil testers, etc.,

must be self-tested and confirmed in accordance with the instrument self-test operation guidelines before daily use.

Copper Thickness Gauge
EDX Machine
Metallographic Analyzer
Peel Strength Tester

Special Circuit Board Materials

Except for the above, we provide a wider range of electronic circuit board materials, such as halogen-free clad, copper core, ceramic clad, Arlon materials, etc. Contact us to customize your PCBs.
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